Stack-up : 2 R+2 F+2 R
Thickness : 0.6 mm
Out Layer Copper Thickness: H OZ
Inner Layer Copper Thickness: H OZ
Min hole size : 0.2 mm
Min Line Width/Space : 3 mil
Surface finish：: ENIG
Application : Facial identification system/ access control
Features : impedance matching
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FLEX PCB & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production
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