TU-662: High Thermal Reliability Laminate and Prepreg
Discover the Superiority of TU-662/TU-66P for Your PCB Needs
Looking for a reliable solution for your PCB applications? TU-662/TU-66P laminate/prepreg is crafted from top-notch woven E-glass coated with an epoxy resin system. This unique combination not only provides UV-blocking properties but also ensures compatibility with Automated Optical Inspection (AOI) processes. Whether you need exceptional thermal cycle resistance or durability during assembly, TU-662 laminates are the ideal choice. They offer outstanding coefficient of thermal expansion (CTE), excellent chemical resistance, and thermal stability suitable for lead-free soldering assembly with general CAF resistance.
Applications in Various Industries
- Automotive
- Consumer Electronics
Key Features of TU-662/TU-66P
- Lead-free process compatibility
- Superb coefficient of thermal expansion
- Anti-CAF properties
- Compatibility with FR-4 processing conditions
- Outstanding chemical and thermal resistance
- Fluorescent for AOI inspections
- UV-blocking for optical clarity
- High interlayer bonding strength with optimal resin flow
- Low moisture absorption
Explore the Material Properties
- Tg (DMA): 160°C
- Tg (DSC): 150°C
- Tg (TMA): 140°C
- Td (TGA): 340°C
- CTE z-axis (50 to 260°C): 3.2%
- T-260/T288: >60 min / >10 min
- Permittivity (RC 50%) @1GHz: 4.3
- Loss Tangent (RC 50%) @1GHz: 0.014
Trusted Industry Approvals
- IPC-4101 Type Designation: /21, /98, /99, /101
- UL Designation – ANSI Grade: FR-4.0
- UL File Number: E189572
- Flammability Rating: 94V-0
- Maximum Operating Temperature: 130°C
Standard Availability Options
- Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
- Copper Foil Cladding: Various options for different needs
- Prepregs: Available in roll or panel form
- Glass Styles: Choose from a variety of options like 106, 1080, 2113, and more
For all your PCB and PCBA inquiries, feel free to reach out to us at info@wellcircuits.com.
