Common Issues in PCB Production and Solutions

• Issue 1: Residues on Solder Mask Surface

  Many PCB manufacturers face challenges with residues on the solder mask surface after development. Excessive pre-baking can lead to incomplete development, resulting in black and white residues. To address this:

  • Ensure proper baking conditions: Pre-bake at 75°C ± 5°C for 40-50 minutes.
  • Use appropriate exposure energy for dual curing effect of heat and light.
  • Extend pre-baking time if necessary to prevent flaking during development.

• Issue 2: Oil Residue in Socket After Development

  Another common problem is finding oil residue in the socket post-development. This issue is often caused by residual oil in the holes. To tackle this:

  • Control silk screen printing to prevent excessive ink in the holes.
  • If ink residue remains, consider re-baking at 75°C for 10 minutes before development.
  • Avoid direct use of caustic soda, as it may lead to further complications.

If you encounter similar challenges in PCB production, feel free to reach out for expert advice and solutions. For all your PCB manufacturing needs, contact us here.