SH260: High-Performance Polyimide PCB Material
Key Features of SH260:
- Ultra-high thermal performance with Tg > 250°C (TMA) and Td > 405°C (5% loss, TGA).
- Lower Z-axis CTE of 1.20% (50-260°C) for superior PTH reliability.
- Maintains mechanical and bonding strength at elevated temperatures.
- Tough resin system with Non-MDA chemistry.
- Halogen-free and RoHS/WEEE compliant for lead-free processing.
- IPC4101D/40, /41 compliant.
Applications of SH260:
- Perfect for Burn-in Boards.
- Suitable for Downhole Applications.
- Ideal for Aerospace and Aircraft industries.
- Recommended for various PCB applications requiring prolonged high-temperature performance.
Product Performance:
Additional Information:
- 1. Specimen thickness: 1.6mm (Electrical Strength and Young’s Modulus Specimen thickness: 0.1mm). Testing method follows IPC-TM-650 standards.
- 2. All values provided are typical and for reference purposes. For detailed data, please consult Shengyi Technology Co., Ltd.
- 3. Explanation: C = Humidity conditioning, D = Immersion conditioning in distilled water, E = Temperature conditioning.
- The figures after the letter symbols denote the duration of preconditioning in hours, the preconditioning temperature in °C, and the relative humidity.
Related Documents:
- SH260 Technical Data Sheet (TDS)
- SH260 Product Lineup
- SH260 Processing Guidelines
- SH260 Laminate SGS Certification
- SH260 Laminate Material Safety Data Sheet (MSDS)
- SH260 Prepreg Material Safety Data Sheet (MSDS)
If you have inquiries about PCB or PCBA, feel free to reach out to us at info@wellcircuits.com.
