Product Material: FR-4 TG150
Layers: 4
Board Thickness: 1.0mm
Surface Finish: OSP (Organic Solderability Preservative)
Line Width/Spacing: 3/3 mil
Minimum Hole Diameter: Mechanical Drilling 0.15mm
Technical Feature: P1.20 High-Density Light Board
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FLEX PCB & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production