Layers : 4L
Thickness : 1.2mm
Out Layer Copper Thickness : H OZ
Inner Layer Copper Thickness : H OZ
Min hole size : 0.2mm
Min Line Width/Space : 4mil
Surface finish : ENIG+osp
Application ：Computer memory board
Features : ICE immersion Gold, other solder pad,OSP
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FLEX PCB & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production
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