Layers: 8L (2R+4F+2R)
Board Thickness: 1.03mm ±10%
Material: S1000-2M + Polyimide (Shengyi)
Line Width/Spacing: 0.076 / 0.1mm
Minimum Hole Diameter: 0.10mm
Surface Finish: Nickel Gold Plating
Special Processes: Two-level HDI, Laser Opening, HI-POT
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WellCircuits ADVANTAGES
- In-house engineering
- Turnkey FLEX PCB & Assembly Solution
- Quick-turn up to 48hrs
- In-house assembly lines
- Support Prototype | Series Production