Product material: FR-4 + PI material,
Number of layers: 6 layers,
Board thickness: 1.00mm,
Line width/spacing: 6/6mil,
Surface process: immersion gold + gold plating,
Stacked structure: 2 + 2 (FLEX PCB) + 2,
Technical features: Rigid and Flex combination; gold-plated connectors; shielding film.