Product material: FR-4 + PI material,
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Number of layers: 6 layers,
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Board thickness: 1.00mm,
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Line width/spacing: 6/6mil,
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Surface process: immersion gold + gold plating,
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Stacked structure: 2 + 2 (FLEX PCB) + 2,
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Technical features: Rigid and Flex combination; gold-plated connectors; shielding film.