6-layer HDI rigid-flex combination PCB

Product material: FR-4 + PI material,

Layers: 6,

Board thickness: 1.20mm,

Surface process: Gold immersion,

Line width/spacing: 4/4mil,

Stack-up structure: 2+2 (FLEX PCB) + 2,

Technical features: HDI Level 1; Rigid-flex technology; Impedance