Product Material: S7136H+FR-4 hybrid press,
Number of Layers: 4 layers,
Board Thickness: 1.60mm,
Surface Process: Gold immersion,
Stack-up Structure: 2+PP+2,
Technical Features: Hybrid press; lamination, electroplating uniformity.
Product Details
Number of Layers: 4 layers,
Board Thickness: 1.60mm,
Surface Process: Gold immersion,
Stack-up Structure: 2+PP+2,
Technical Features: Hybrid press; lamination, electroplating uniformity.
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Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.
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