Product material: FR-4 + PI material,
Number of layers: 4 layers,Board thickness: 1.20mm,Surface process: gold immersion,Line width/line spacing: 4/4 mil,Stack structure: 1 + 2 (FLEX PCB) + 1,Technical features: rigid-flex combination; HDI first stageHome » Shop » PCB Fabrication » 4-layer HDI first-level RF combination PCB