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16-layer high-speed back drilling PCB

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Product Details
A 16-layer high-speed back-drilled PCB is a printed circuit board used in high-density, high-performance electronic devices. The back-drilling process in multi-layer PCBs is especially important as it helps optimize signal paths, reduce signal loss and interference, and improve overall signal integrity.
Lianmao IT968G is a commonly used high-speed PCB material known for its excellent electrical performance and mechanical stability, making it suitable for high-speed circuits

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14-layer HDI of any level

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Product Details
The 6-layer interconnection HDI PCB blind/buried via board is one of the HDI series 6-layer circuit boards developed and produced by Qinlv Internation Co., Ltd.
This HDI blind/buried via board is manufactured using Taiyao TU-872SLK material, employing multiple laser drilling and lamination processes.
The minimum line width and spacing can reach 33 mil, and the minimum hole diameter can be as small as 0.1 mm.
This HDI blind/buried circuit board is widely used in digital camera

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16-layer HDI of any order

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**Product Details**
The 16-layer 7-step HDI arbitrary interconnection buried hole PCB is one of the HDI series circuit boards developed and produced by Qinlv Internation Co., Ltd. This 7-step HDI buried hole circuit board is made from Shengyi S1000-2M material, and formed through multiple laser drilling and lamination processes. It is widely used in high-end automotive main control servers, aerospace, and military industries. High-density interconnection HDI printed circuit boards (PCBs) play a

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10-layer high-frequency mixed-pressure HDI first-order PCB

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**Product Details**
The 10-layer high-frequency hybrid HDI first stage is developed and produced by Shenzhen Jianxiangsheng Technology Co., Ltd. as part of their high-frequency and high-speed series of circuit boards.

 

This circuit board is made using RO4350BFR-4 hybrid high-quality substrate through processes such as laser drilling and surface gold plating.

 

The main technical features and challenges of this 10-layer high-frequency hybrid HDI first stage include advance

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