In high frequency PCB design, “hybrid build” is often used to realize a balance between cost, reliability, and electrical performance. A hybrid construction could use a mix of FR-4 materials with high-frequency materials,or a mix of high-frequency materials with different dielectric constants, etc.
There are a few broad situations where you could consider using a hybrid stackup:
- Cost savings: Going all-PTFE or all-low-Dk materials is costly. The cost difference is not obvious at the prototyping stage, but it will add up greatly at series production.
- Low RF interconnect count: If all the high-speed/RF signals can be placed on one layer, it is a smart choice to use PTFE on a single circuit layer while the rest layers can be FR-4.
- mmWave designs: Some RF systems operating in the ISM band or 6-7 GHz WiFi will operate just fine on FR4-grade laminates as long as interconnects are short. Once you get to car radar frequencies or higher, you will generally need low-loss laminates unless your interconnects are very short as to be impractical.