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8-layer RF combination PCB

Product material: FR-4 + PI material,

Number of layers: 8 layers,

Board thickness: 1.60mm,

Surface process: Gold immersion,

Line width/line spacing: 3/3 mil,

Stack structure: 2+2 (FLEX PCB) + 2 (FLEX PCB) + 2,

Technical features: 2 pieces / 4-layer FLEX PCB lamination.

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Product: 8-layer RF combination PCB
Supported: ZIP, RAR, 7Z, PDF, Gerber files (Max 20MB)

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WellCircuits
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