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8-layer HDI RF PCB

Layers: 8L (2R+4F+2R)
Board Thickness: 1.03mm ±10%
Material: S1000-2M + Polyimide (Shengyi)
Line Width/Spacing: 0.076 / 0.1mm
Minimum Hole Diameter: 0.10mm
Surface Finish: Nickel Gold Plating
Special Processes: Two-level HDI, Laser Opening, HI-POT

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Product: 8-layer HDI RF PCB
Supported: ZIP, RAR, 7Z, PDF, Gerber files (Max 20MB)

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