6-layer RF combination PCB

Product material: FR-4 + PI material,

Number of layers: 6 layers,

Board thickness: 1.00mm,

Line width/spacing: 6/6mil,

Surface process: immersion gold + gold plating,

Stacked structure: 2 + 2 (FLEX PCB) + 2,

Technical features: Rigid and Flex combination; gold-plated connectors; shielding film.

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