Flexible Circuit Board (FPC) Production Process
Key Steps for High-Quality FPC Boards
- Comprehensive and well-structured production process
- Precision in every step from pre-production to shipment
- Prevention of excessive openings to avoid low yield rates
- Selection of materials for customer-specific flexible wire boards
Prenatal Pretreatment Importance
Prenatal pretreatment is crucial for successful FPC production. Three key aspects managed by engineers:
- Engineering evaluation of FPC board design
- Prompt preparation of materials post-evaluation
- Adjustment of customer’s CAD data to production specs
Production Process Details
- Surface treatments: immersion gold, anti-oxidation, gold plating, tin spraying
- Shape treatments: manual shaping, CNC cutting, laser cutting
- Substrate copper thickness options: 1/3 oz, 1/2 oz, 1 oz, 2 oz, 4 oz
- Line width and spacing down to 0.065 mm
Features of Flexible Circuit Boards (FPCs)
- Short assembly time, no need for extra cables
- Compact size for product volume reduction
- Lighter weight and thinner profile than PCBs
Future of FPCs
With the market expanding in China and global companies investing, FPCs are evolving. Innovation is key for FPCs to break the cycle of development, decline, and elimination.
Testing and Development
Specialized FPC testers and optical image measuring devices ensure quality and dimensional accuracy, making FPCs ideal for digital products like smartphones and laptops.
