Revolutionizing the PCB Industry with HDI Technology
High Density Interconnect Board (HDI)
HDI technology has transformed the PCB industry, with Huaqiu Circuit leading the way in manufacturing highly reliable multilayer boards online. By utilizing 0.1mm laser drilling and advanced blind buried hole techniques, Huaqiu Circuit produces top-of-the-line 20-layer, 1-3 stage high-end HDI boards with unparalleled precision. Our commitment to enhancing efficiency and reducing costs in the electronics sector drives us to excel as both innovators and practitioners in the field.
As the global chip technology landscape faces ongoing challenges, HDI technology plays a crucial role in driving innovation and progress in the electronics domain.
0.1mm Laser Drilling: Breaking Conventional Boundaries
Traditional PCB drilling methods are surpassed by the precision of 0.1mm laser drilling technology. WellCircuits’ expertise in 1-3 HDI boards, with mature blind hole burial technology, meets design requirements with utmost precision.
The Evolution of HDI Boards
HDI boards have emerged as a groundbreaking advancement in the PCB industry, allowing for higher interconnection densities and smaller pad sizes. WellCircuits’ utilization of laser drilling enables greater line distribution per unit area, ensuring genuine high-density interconnection.
With the evolution of technology and product demands, the focus has shifted towards second-order or higher HDI configurations, which have become the norm in the market. WellCircuits, with 15 years of industry dedication, specializes in crafting reliable PCBs using advanced blind hole and laser drilling processes.
Meeting User Needs with High Reliability
The production of HDI boards differs significantly from traditional PCBs, with increasing complexity and precision requirements. WellCircuits’ unwavering commitment to quality ensures that our high reliability HDI boards cater to a wide range of user needs, delivering the ultimate user experience.
