Common Defects in SMT Chip Processing

• Empty Soldering: Lack of solder between component pin and solder pad.
• Cold Soldering: Incomplete melting of solder, leaving granular residues.
• Bridging: Excess solder causing unintended connections between pins.
• Incorrect Parts: Parts not meeting operational requirements.
• Missing Parts: Components not placed correctly, leading to empty spots.
• Polarity Reversal: Incorrect orientation of polarity.
• Parts Upside Down: SMT parts should not be placed upside down.
• Part Offset: Offset between soldering point and PAD position should not exceed 1/2 of the PAD area.
• Tin Pad Damage: Damage to PAD during reflow processes.
• Pollution and Uncleanness: Unclean board surface or foreign matter between pins.
• SMT Board Burst: Board bursting in the reflow oven due to poor material or abnormal temperature.
• Overlay Welding: Excess solder obscuring part leads.

Various defects can occur during SMT chip processing, impacting product quality. Manufacturers implement countermeasures to address these issues effectively.