Complete PCB Copying Process Using a Four-Layer Computer Motherboard

This guide demonstrates the step-by-step process of copying a PCB using a four-layer computer motherboard, along with essential methods and techniques.

Overview of the Motherboard:

• Features various chipsets, interfaces, and socket expansion slots
• Includes intact components for reference

Process Breakdown:

1. Preliminary Preparations:
   • Dismantle the Board:
   • Take clear photos of the motherboard’s front and back
   • Remove components using a heat gun and tweezers
   • Record component details for later reference
2. Disassemble Components:
   • Remove resistor, capacitor, and IC in order
   • Document components and their values
   • Measure component values post-disassembly
3. Remove Solder:
   • Clean PCB surface after component removal
   • Use flux and solder wick to remove excess solder
   • Adjust soldering iron temperature based on PCB layers
4. Surface Copy Board:
   • Scan the Surface Board:
   • Polish PCB surfaces to expose copper
   • Scan upper and lower layers in color
   • Draw the Surface Layer PCB Board:
   • Adjust image contrast and brightness in PHOTOSHOP
   • Save clear images in black and white BMP format
   • Convert Files to PROTEL Format:
   • Import BMP files into PROTEL as two layers
   • Check alignment of PAD and VIA positions
   • Prepare the PCB Layout:
   • Convert images to PCB format with SILK layer
   • Trace layers and place components on the drawing
   • Final Verification:
   • Combine layers into a single image in PROTEL
   • Print on transparent film for alignment check