Preventing PCB Bending and Warping in Reflow Furnace Processing

Effective Strategies to Maintain PCB Integrity

• Minimizing Temperature Impact on PCB Stress

Controlling reflow oven temperature and heating/cooling rates can reduce bending and warping risks.

• Choosing High Tg Materials

Utilizing materials with higher glass transition temperatures enhances PCB resilience against deformation.

• Optimizing Circuit Board Thickness

Consider using a 1.6mm thickness to prevent bending and deformation issues during reflow.

• Reducing Board Size and Panels

Orient boards along the reflow furnace chain edge to minimize weight-related deformation.

• Utilizing Furnace Tray Fixtures

Reflow carriers and templates can support PCBs during thermal expansion, reducing bending risks.

• Using Routing Instead of V-Cut for Sub-boards

Avoid V-Cut techniques to maintain panel integrity between circuit boards.

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