Common Challenges in Acid Copper Plating Process
- Electroplating Pits
- Whitish or Uneven Color on Board Surface
Electroplating pits can form due to various processes, including copper immersion, pattern transfer, electroplating pretreatment, copper plating, and tin plating. Inadequate cleaning of the copper hanging basket during copper immersion can lead to pit formation on the PCB surface. Issues during the graphics transfer process are often caused by poor equipment maintenance and contamination. Proper pre-treatment is crucial to prevent pit formation, as high water hardness and poor encapsulation of hangers can result in non-conductive particles adsorbing on the board surface.
Whitish or uneven color on the board surface can be caused by various factors, such as issues with the acid copper electroplating tank, inadequate cleaning after acid degreasing, micro-etching problems, and misadjustment of brightening agents. Addressing problems like uneven air agitation, contamination from inferior cotton cores, and improper handling of plating leakage promptly can help prevent surface discoloration and maintain coating quality.
Enhancing Acid Copper Plating Craftsmanship
This article discusses the importance of troubleshooting and innovation in improving acid copper plating craftsmanship. Proper selection and application of acid copper brighteners play a key role in enhancing the brightness, leveling properties, and throwing power of the plating layer. Continuous learning, problem-solving, and attention to detail are essential for advancing craftsmanship and elevating the quality of electroplating processes.
