Rigid Flex PCB Design Guidelines

  • Flexible Zone Design Requirements:

    1. Utilize tear shapes between thick and thin lines to prevent abrupt expansion or contraction.
    2. Avoid sharp angles by using rounded corners.
  • Maximizing Pad Size:

    When electrical requirements are met, maximize pad size and ensure smooth transitions between bonding pads and conductors.

  • Dimensional Stability:

    Maximize copper usage in the design and incorporate solid copper areas in waste regions for dimensional stability.

  • Covering Film Window Design:

    • Include manual alignment holes for improved accuracy.
    • Design window openings to accommodate glue flow variations.
    • Consider special mold designs for small, densely packed window openings.
  • Rigid Deflection Transition Zone:

    1. Ensure smooth line transitions perpendicular to the bending direction.
    2. Evenly distribute conductors in the bending area.
    3. Maximize wire width across the bending area and avoid certain design elements.
  • Flexible Area with Air Gap Requirements:

    • Avoid through holes in bending areas.
    • Add protective copper wire to sides of the line for reinforcement.
    • Design line connections as arcs and increase bending area without affecting assembly.
  • Other Considerations:

    Avoid sharing tool holes on flexible boards and reinforce FPCs for improved durability using materials like PI, steel sheet, or FR4.

FPC Reinforcement Options:

  • PI Reinforcement: Offers high precision and temperature resistance with various thickness options.
  • Steel Sheet Reinforcement: Provides stability but requires manual assembly.
  • FR4 Reinforcement: Offers rigidity with controlled tolerances based on thickness.

Each FPC reinforcement type has its advantages and disadvantages, catering to different design requirements.

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